***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Jan 25, 2018                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt 1SMB3EZ6P2 A K
.param
+vc0 = 1.287e-11	 vc1 = 9.000e-11	 vc2 = 9.612e-12	 vc3 = 3.026
+tc1 = 1.733e-2		 tc2 = 2.524e-2		 tc3 = 5.237e-3		 tc4 = 4.871e-3
d1 A K zener
g1 K A value = {(vc0+vc1*v(K,A))*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc2*exp(vc3*v(K,A)))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.model zener d
***** flag parameter ***
+level = 1   
***** dc model parameter ***
+ is = 2.621e-15	   n = 1.006		  rs = 1.929e-2		ikf = 4.845
+ibv = 120e-3		 nbv = 0.8		  bv = 6.2
***** capacitance parameter ***
+cjo = 8.409e-10	   m = 3.463e-1		  vj = 7.508e-1
+ fc = 0.5                      
***** temperature coefficient ***
+tnom = 25		  eg = 1.125		 xti = 3
+trs1 = 1.231e-4	trs2 = 3.841e-6		tbv1 = 3.378e-4
.ends 1SMB3EZ6P2 
*$
